Shanghai Lead Free Conference 2004

IPC, CEPEA and CEAC 2004 International Conference on Lead Free Electronics
"Towards Implementation of the RoHS Directive",November 16-17 - Shanghai, China


IPC - Association Connecting Electronics Industries , CEPEA – China Electronics Professional Equipment Association and CEAC – China Electronics Appliance Corporation , along with event supporters Soldertec Global – a division of Tin Technology and JEDEC - the Solid State Technology Association, are sponsoring the 2004 International Conference on Lead-Free Electronics. The conference will be held November 16-17, 2004 in conjunction with the China Electronics Appliance Corporation's China Electronic Fair. The venue will be: Shanghai New Int'l Exhibition Centre.
SPONSORSHIP OPPORTUNTIES
GOLD SPONSOR
BRONZE SPONSORS
SPEAKER SPONSORS
Your company has an opportunity to take advantage of the sponsorship opportunities at this event. IPC has a limited number sponsorship opportunities available at the conference, click here to view the available sponsorship opportunies.
Get ahead of the competition by signing up for a sponsorship opportunity today! For more information please contact Alexandra Curtis at 847-597-2877 or via e-mail at AlexandraCurtis@ipc.org
CONFERENCE AGENDA
November 16, 2004
November 17, 2004
9:20 - 9:50 China Electronic Equipment market current status and trends - Bohua Wang, Ministry of Information Industry 9:20 - 9:50 China ROHS Directive Introduction and Overview - Jianzhong Huang , Ministry of Information Industry
9:50 - 10:20 Lead Free Electronic Products Reliability Testing - Terence Hsieh, SGS 9:50 - 10:20 Challenges and solutions of Lead Free implementation in manufacturing environment - Sammy Yi, Flextronics
10:20 - 10:50 The RoHS Directive; an Update on the Regulations and Compliance - Kay Nimmo, ITRI 10:20 - 10:50 Development of Pin-Testable Lead Free Solder Paste - Eric Wu, Henkel Technologies
10:50 - 11:00 Tea Break 10:50 - 11:00 Tea Break
11:00 - 11:30 The Latest Printing Technology Corresponding to Lead Free - Changyu Deng, Horiba 11:00 - 11:30 Factors in Lead Free Solder Paste Formulation that Affect the Formation of Voids in Reflowed Assemblies: Part II - Mark Currie, Henkel Technologies
11:30 - 12:00
Lead Free SMT Assembly Effects on Connector Housing Resins: Adoption of IPC/JEDEC J-STD-033A to Ensure Lead Free Compatibility - John McMullan, DSM Engineering Plastics 11:30 - 12:00 Lead Free Soldering Status and Projects of Japan - Katsuaki Suganuma, Osaka University
12:00 - 13:00 Lunch 12:00 - 13:00 Lunch
13:00 - 13:30 Implantable Medical Electronics Assembly's Quality and Reliability Considerations - Kon-Mang Lin, Ph.D., Universal Instruments 13:00 - 13:30 Effect of SAC Composition on Soldering Performance - Ning-Cheng Lee, Ph.D., Indium
13:30 - 14:00 Update Printing Technologies Corresponding to Lead Free- Hitachi 13:30 - 14:00 Minimization of Tin Whisker Growth in Lead Free Component Production Applications - Rob Schetty, Technic Inc.
14:00 - 14:30 Bar Code Labels are Components Too - Jane Miao, Polyonics, Inc 14:00 - 14:30 Reliability Study of A New Lead Free Sn- Ag-Bi-In Solder for Precision Motor Application - Sean Yoo, Samsung Electro-Machanics Co., Ltd.
14:30 - 15:00 A Research Program on SAC Lead Free Alloys - David Bergman, IPC 14:30 - 15:00 Long-term Reliability Assessment of Lead-free Soldered Electronics - Ji Wu, CALCE, University of Maryland
15:00 - 15:15 Tea Break 15:00 - 15:15 Tea Break
15:15 - 15:45 Evolution of Lead Free Solder - Turning the Tin-Copper Eutectic into a User-Friendly Solder- Keith Sweatman & Daisuke Watanabe, Nihon Superior 15:15 - 15:45 A Practical Approach for use of Lead Free Soldering in SMT Reflow - Marc Peo, Heller Industries Inc.
15:45 - 16:15 Development of a High Performance Lead Free Wave Solder Alloy - Tim Ho, Cookson Electronics 15:45 - 16:15 A Practical Approach for use of Lead Free Soldering in SMT Reflow - Marc Peo, Heller Industries Inc.
16:15 - 16:45 High Speed Lead Free Reflow Soldering - Roger Han, Vitronics Soltec 16:15 - 16:45 Global Lead Free New Trend - John Lau, Ph.D., Agilent Technologies, Inc.
There are still presentation slots available for this conference but they are filling up quickly so please complete and send back to IPC the sponsorship application as soon as possible to LFShanghai@ipc.org or Alexandra Curtis at AlexandraCurtis@ipc.org.

by Sean | 2004/11/08 22:45 | Pb-free Club | 트랙백 | 덧글(0)

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